The government unveiled the Semicon 2.0 roadmap at SEMICON India 2026 in New Delhi.
The programme has an outlay of Rs 1.275 lakh crore, approved by the Union Cabinet in July 2026.
It is structured around six pillars, including chip design, fabrication and talent development.
Semicon 2.0 aims to create close to one lakh new jobs and support 200 chip-design start-ups.
Investment commitments of about Rs 1 lakh crore have been received under the programme so far.
The government unveiled the Semicon 2.0 roadmap at SEMICON India 2026, held at Yashobhoomi in New Delhi.
The Union Cabinet had approved Semicon 2.0 in July 2026 with an outlay of Rs 1.275 lakh crore, or about $13.23 billion.
Semicon 2.0 is structured around six pillars: chip design, machines and materials, fabrication facilities, advanced packaging, applied research and development, and talent development.
The programme aims to create close to one lakh new jobs across the semiconductor ecosystem.
It targets training 100,000 technicians for cleanroom and factory-floor roles.
Semicon 2.0 aims to support at least 200 chip-design start-ups and companies.
Investment commitments of about Rs 1 lakh crore, or $11-12 billion, have been received under the programme so far.
SEMICON India 2026 was the fifth edition of the event, inaugurated by Prime Minister Narendra Modi on September 17.
The three-day conference brought together more than 600 companies from 52 countries.
SEMICON India 2026 was themed ‘Silicon to Systems: Building the Ecosystem’.
The event was organised by the India Semiconductor Mission, the Ministry of Electronics and Information Technology, and SEMI.
Semicon 2.0 is described as the next phase of India’s broader semiconductor programme.
India has set a longer-term target of building a $200 billion domestic semiconductor market.
The India Semiconductor Mission was set up to coordinate the country’s chip manufacturing and design push across ministries.
Semiconductor wafer (representative image), Wikimedia Commons, CC BY-SA 4.0
